Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/176839
Kind Code:
A1
Abstract:
Provided is a solid-state imaging device having achieved improved near-infrared wavelength sensitivity and reduced color-mixing, without putting constraints on wiring layout. The solid-state imaging device is provided with: a substrate having formed therein a plurality of photoelectric converters corresponding to different wavelengths of light and subjecting incident light to photoelectric conversion; a transistor stacked on a surface of the substrate opposite a light incident side surface thereof and located on the photoelectric converter side to subject charge output from the photoelectric converters to signal processing; a wiring layer located opposite a photoelectric converter side of the transistor and having wiring for transferring an electric signal obtained by the transistor; and a reflective design film formed at least on the transistor side from a joint portion of the substrate and the wiring layer, the reflective design film being more reflective than the wiring layer and reflecting a vertical component of incident light.
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Inventors:
MASUDA YOSHIAKI (JP)
Application Number:
PCT/JP2021/000381
Publication Date:
September 10, 2021
Filing Date:
January 07, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L31/0216; H01L31/0236; H01L31/10; H04N5/369
Domestic Patent References:
| WO2018079296A1 | 2018-05-03 |
Foreign References:
| JP2006261372A | 2006-09-28 | |||
| US20080036022A1 | 2008-02-14 |
Other References:
See also references of EP 4117037A4
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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