SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE - SONY SEMICONDUCTOR SOLUTIONS CORP

Title:

SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/161791

Kind Code:

A1

Abstract:

A solid-state imaging device (200) is provided with: a plurality of photoelectric conversion elements (311); a plurality of current-voltage conversion circuits (320); a plurality of address event detection circuits (231); a first grounding wiring (424); and a second grounding wiring (421). The photoelectric conversion elements (311) are arranged sider by side in a first region. The current-voltage conversion circuits (320) convert currents outputted from the photoelectric conversion elements (311) into voltages. The address event detection circuits (231) detect the changes of the voltages outputted from the current-voltage conversion circuits (320). The first grounding wiring (424) is provided in a second region positioned outside the first region, and supplies first ground potential to the photoelectric conversion elements (311). The second grounding wiring (421) is provided in the second region, and supplies, to the current voltage conversion circuits (320), second ground potential of a voltage value different from that of the first ground potential.

Inventors:

HANADA TAKUYA (JP)
TSUCHIMOTO KOYA (JP)
NAKAMURA MAKOTO (JP)
NODA YUKI (JP)
MURAKAWA YUSUKE (JP)
KITANO SHIN (JP)

Application Number:

PCT/JP2021/002964

Publication Date:

August 19, 2021

Filing Date:

January 28, 2021

Export Citation:

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Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

International Classes:

H04N5/357; H04N5/3745

Domestic Patent References:

WO2019087471A1

2019-05-09

Foreign References:

JP2019195135A	2019-11-07
JP2013017095A	2013-01-24
JP2016533140A	2016-10-20
JP2019195135A	2019-11-07

Other References: