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Title:
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/145082
Kind Code:
A1
Abstract:
The present invention suppresses the influence of incident light in a dam region for blocking the outflow of resin from a chip mounted region. This solid-state imaging element is provided with a pixel region in which a plurality of pixels are arranged, and a chip mounted region in which a chip is mounted. A dam region for blocking the outflow of resin from the chip mounted region is disposed around the chip mounted region. The dam region has in at least a part thereof a saw-shape facing outward. The incident light is repeatedly reflected at the saw-shape of the dam region, absorbed, and attenuated.

Inventors:
TANAKA TAKAYUKI (JP)
BABA TOMOHIKO (JP)
Application Number:
PCT/JP2020/044823
Publication Date:
July 22, 2021
Filing Date:
December 02, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/29; H01L21/60; H01L23/31; H01L27/146; H04N5/335
Domestic Patent References:
WO2016039173A12016-03-17
Foreign References:
JP2018147974A2018-09-20
JPH0897535A1996-04-12
JP2008187054A2008-08-14
JP2014027069A2014-02-06
JP2016163011A2016-09-05
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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