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Patent Searching and Data


Title:
SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/050345
Kind Code:
A1
Abstract:
A solid-state imaging element according to the present invention comprising a semiconductor substrate having a plurality of light-receiving elements in a matrix, and a plurality of microlenses formed to respectively correspond to the plurality of light-receiving elements, wherein a protrusion made of photosensitive resin is formed between or at a boundary of adjacent microlenses.

Inventors:
TOMIOKA SHUNGO (JP)
Application Number:
PCT/JP2021/032276
Publication Date:
March 10, 2022
Filing Date:
September 02, 2021
Export Citation:
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Assignee:
TOPPAN INC (JP)
International Classes:
H01L27/146; G02B3/00; H04N5/369
Domestic Patent References:
WO2018193986A12018-10-25
Foreign References:
JP2016036004A2016-03-17
JP2012256782A2012-12-27
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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