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Patent Searching and Data


Title:
SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/111816
Kind Code:
A1
Abstract:
[Problem] To provide a solid-state imaging device capable of reducing variations in charge transfer to a memory unit or noise variations. [Solution] The solid-state imaging device according to the present disclosure is provided with: a semiconductor substrate having a first surface substantially orthogonal to a thickness direction; a photoelectric converter which is provided on the semiconductor substrate and generates, by photoelectric conversion, charges corresponding to the amount of incident light from a second surface of the semiconductor substrate opposite the first surface; a charge holder which is disposed in the thickness direction relative to the photoelectric converter and holds charges transferred from the photoelectric converter; a transfer transistor which transfers the charges generated by the photoelectric converter from the photoelectric converter to the charge holder; a first light-shield unit provided between the photoelectric converter and the charge holder so as to overlap the charge holder when viewed from the thickness direction; and a first trench member provided between the first light-shield unit and the transfer transistor.

Inventors:
FUKUI RYO (JP)
MACHIDA TAKASHI (JP)
SHIIHARA YU (JP)
MATSUMURA YUSUKE (JP)
Application Number:
PCT/JP2020/041732
Publication Date:
June 10, 2021
Filing Date:
November 09, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/369
Foreign References:
JP2014096490A2014-05-22
JP2018148039A2018-09-20
JPH05188148A1993-07-30
JP2015046477A2015-03-12
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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