Title:
SOLID-STATE IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/240998
Kind Code:
A1
Abstract:
Provided is a solid-state imaging element with which it is possible to minimize crosstalk between different pixel columns while minimizing any decrease in quantum efficiency of photoelectric conversion units due to pixel separation parts. The present invention comprises a plurality of pixels that are arranged in a two-dimensional matrix in x- and y-directions and that have a photoelectric conversion unit (N-type semiconductor thin film) containing a compound semiconductor. The present invention comprises pixel separation parts arranged only on pixel boundaries that are extending in the x-direction.
Inventors:
MARUYAMA SHUNSUKE (JP)
Application Number:
PCT/JP2021/014297
Publication Date:
December 02, 2021
Filing Date:
April 02, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/76; H01L27/146; H04N5/374
Domestic Patent References:
| WO2018016181A1 | 2018-01-25 | |||
| WO2018139110A1 | 2018-08-02 | |||
| WO2012004923A1 | 2012-01-12 | |||
| WO2019155841A1 | 2019-08-15 |
Foreign References:
| JP2013005297A | 2013-01-07 | |||
| JP2016158151A | 2016-09-01 | |||
| JP2015119154A | 2015-06-25 | |||
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Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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