Title:
SOLVENT-FREE ACRYLIC RESIN COMPOSITION, SOLVENT-FREE ACRYLIC ADHESIVE USING SAME, ADHESIVE SHEET, AND PRODUCTION METHOD FOR SOLVENT-FREE ACRYLIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/123892
Kind Code:
A1
Abstract:
Provided is a solvent-free acrylic resin composition that exhibits a small increase in viscosity due to heating, that has excellent thermal stability, that can be applied thickly when used as an adhesive, and that can be used to obtain an adhesive which has excellent conformability to uneven surfaces, corrosion resistance, and wet heat haze resistance. This solvent-free acrylic resin composition contains an acrylic resin (A), wherein the acrylic resin (A) contains 5-60 wt% of a structural moiety derived from a hydroxy group-containing monomer (a1), and the acid value in the resin composition is 0.001-0.3 mgKOH/g.
Inventors:
ASANO TETSUYA (JP)
NAKASHIMA TAKAHIRO (JP)
NOHARA KAZUKI (JP)
NAKASHIMA TAKAHIRO (JP)
NOHARA KAZUKI (JP)
Application Number:
PCT/JP2018/041889
Publication Date:
June 27, 2019
Filing Date:
November 13, 2018
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L33/06; C08F220/18; C08K5/29; C08L33/14; C09J7/00; C09J11/06; C09J133/06; C09J133/14
Domestic Patent References:
| WO2014167890A1 | 2014-10-16 |
Foreign References:
| JP2017210610A | 2017-11-30 | |||
| JP2013116983A | 2013-06-13 | |||
| JP2017039857A | 2017-02-23 | |||
| JP2016035046A | 2016-03-17 | |||
| JP2018070789A | 2018-05-10 |
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
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