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Title:
SOLVENTLESS PHOTOCURABLE LIQUID COMPOSITION, CURED PRODUCT THEREOF, OPTICAL FILLER CONTAINING SAME, AND DISPLAY DEVICE INCLUDING LAYER COMPRISING SAID CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/167053
Kind Code:
A1
Abstract:
[Problem] To provide: a photocurable liquid silicone composition having a low viscosity which enables easy pouring into a small gap, is rapidly cured through irradiation with high energy rays such as ultraviolet radiation, has a high refractive index after being cured with light in both the visible light region and the infrared region, enables a composition that yields a low dielectric constant to be arbitrarily designed, and is particularly useful as a material for a device in which an infrared LED light source is used; a cured product of the composition; an optical filler containing same; and a display device including a layer comprising said cured product. [Solution] Provided is a low viscosity solventless photocurable liquid composition that contains: (A) one or more organosilanes or organopolysiloxanes which have an average of one or more photoreactive functional groups in the molecule and two or more monovalent functional groups selected from among aromatic groups having 6-12 carbon atoms and aralkyl groups having 7-12 carbon atoms and in which the number of silicon atoms is 1-5; and, optionally, (C) a curing catalyst. Also provided are: cured product of the composition; an optical filler containing same; and a display device including a layer comprising said cured product.

Inventors:
OGAWA TAKUYA (JP)
Application Number:
PCT/JP2021/006287
Publication Date:
August 26, 2021
Filing Date:
February 19, 2021
Export Citation:
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Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08G59/18; G02B1/04; H01L33/00; H01L33/56
Domestic Patent References:
WO2016167347A12016-10-20
Foreign References:
JP2016084373A2016-05-19
JP2018090806A2018-06-14
JP2007246894A2007-09-27
JP2008303343A2008-12-18
JP2012001668A2012-01-05
US20070299165A12007-12-27
CN110894361A2020-03-20
JP2007008996A2007-01-18
JP5392805B22014-01-22
JP2018111792A2018-07-19
JP2019117325A2019-07-18
Other References:
See also references of EP 4108699A4
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