Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SOUND ABSORBING MATERIAL, SOUND ABSORBING PROPERTY IMPROVING MEMBER, AND VEHICLE MEMBER
Document Type and Number:
WIPO Patent Application WO/2021/182466
Kind Code:
A1
Abstract:
Provided is a sound absorbing member comprising, in this order, a resin film, a first substrate layer having a communication hole, and a second substrate layer having a communication hole. The density of the first substrate layer is higher than the density of the second substrate layer.

Inventors:
TAKAYASU SATOSHI (JP)
YOKOKURA AI (JP)
KOTAKE TOMOHIKO (JP)
Application Number:
PCT/JP2021/009275
Publication Date:
September 16, 2021
Filing Date:
March 09, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B5/18; D04H1/4374; D04H1/593; G10K11/168
Foreign References:
JP2005227747A2005-08-25
JP2003216158A2003-07-30
JP2007086505A2007-04-05
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: