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Patent Searching and Data


Title:
SPACER PARTICLES, ADHESIVE AGENT AND ADHESIVE STRUCTURAL BODY
Document Type and Number:
WIPO Patent Application WO/2019/230881
Kind Code:
A1
Abstract:
Provided are spacer particles which suppress defects in an object for adhering, can control a gap to a high degree of precision, and can effectively relieve stress. In the spacer particles according to the present invention, the ratio of the compressive modulus of elasticity when compressed 30% at 200°C to the compressive modulus of elasticity when compressed 30% at 25°C is 0.5-0.9.

Inventors:
YAMADA YASUYUKI (JP)
UEDA SAORI (JP)
TAKAHASHI HIDEYUKI (JP)
Application Number:
PCT/JP2019/021518
Publication Date:
December 05, 2019
Filing Date:
May 30, 2019
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; B32B5/16; B32B7/12; C09J11/08
Domestic Patent References:
WO2017155116A12017-09-14
Foreign References:
JP2018080325A2018-05-24
JP2013214417A2013-10-17
JP2001083524A2001-03-30
JP2011198953A2011-10-06
JP2009158712A2009-07-16
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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