Title:
SPACER PARTICLES, ADHESIVE AGENT AND ADHESIVE STRUCTURAL BODY
Document Type and Number:
WIPO Patent Application WO/2019/230881
Kind Code:
A1
Abstract:
Provided are spacer particles which suppress defects in an object for adhering, can control a gap to a high degree of precision, and can effectively relieve stress. In the spacer particles according to the present invention, the ratio of the compressive modulus of elasticity when compressed 30% at 200°C to the compressive modulus of elasticity when compressed 30% at 25°C is 0.5-0.9.
Inventors:
YAMADA YASUYUKI (JP)
UEDA SAORI (JP)
TAKAHASHI HIDEYUKI (JP)
UEDA SAORI (JP)
TAKAHASHI HIDEYUKI (JP)
Application Number:
PCT/JP2019/021518
Publication Date:
December 05, 2019
Filing Date:
May 30, 2019
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; B32B5/16; B32B7/12; C09J11/08
Domestic Patent References:
WO2017155116A1 | 2017-09-14 |
Foreign References:
JP2018080325A | 2018-05-24 | |||
JP2013214417A | 2013-10-17 | |||
JP2001083524A | 2001-03-30 | |||
JP2011198953A | 2011-10-06 | |||
JP2009158712A | 2009-07-16 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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