Title:
SPECTRUM CHIP AND PREPARATION METHOD THEREFOR, AND SPECTRUM ANALYSIS DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/161428
Kind Code:
A1
Abstract:
The present application provides a spectrum chip and a preparation method therefor, and a spectrum analysis device. The preparation method for a spectrum chip comprises: forming at least one light modulation structure on a substrate to obtain a modulation unit; and coupling the modulation unit to a sensing unit, so that the modulation unit is held on a photosensitive path of the sensing unit to obtain a spectrum chip. In this way, the process of forming the light modulation structure is transferred to the substrate. Thus, on the one hand, the limitation that existing spectrum chip manufacturing processes are limited by a wafer factory is broken, and on the other hand, that no pollution to a manufacturing site is caused during the preparation process can be ensured.
Inventors:
ZHANG HONG (CN)
HUANG ZHILEI (CN)
WANG YU (CN)
QIN QIUJUN (CN)
HUANG ZHILEI (CN)
WANG YU (CN)
QIN QIUJUN (CN)
Application Number:
PCT/CN2022/074239
Publication Date:
August 04, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
BEIJING SEETRUM TECH CO LTD (CN)
International Classes:
H01L27/146; G01J1/04; G01J1/42
Foreign References:
| CN215069988U | 2021-12-07 | |||
| CN111854949A | 2020-10-30 | |||
| CN111490060A | 2020-08-04 | |||
| US10797920B1 | 2020-10-06 |
Attorney, Agent or Firm:
BEIJING TANGSONG IP FIRM (CN)
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