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Title:
SPHERICAL CRYSTALLINE SILICA PARTICLES AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/235530
Kind Code:
A1
Abstract:
(Problem) To provide: spherical silica particles which are suitable for use as a filler for a semiconductor sealing material having excellent dielectric properties in the millimeter wave band, i.e., spherical crystalline silica particles which are reduced in the contents of an alkali metal and an alkaline earth metal to lower levels and have a high crystallization rate and a high quartz content; and a method for producing the spherical crystalline silica particles. (Solution) Provided are spherical crystalline silica particles each having a degree of circularity of 0.80 or more, containing lithium in an amount of 0.02% by mass or more and less than 0.40% by mass in terms of oxide content, also containing calcium in an amount of 0.004% by mass or more and less than 1.0% by mass in terms of oxide content, and also containing a crystalline silica phase, in which the content ratio of the crystalline silica phase in the spherical crystalline silica particles is 40.0% or more, and the content ratio of quarts in the crystalline silica phase is 80.0% by mass or more.

Inventors:
TANAKA, Mutsuhito (JP)
NUMAO, Ryutaro (JP)
AOYAMA, Yasuhiro (JP)
KUSUNOKI, Kazuhiko (JP)
USHIO, Shoji (JP)
Application Number:
PCT/JP2021/019250
Publication Date:
November 25, 2021
Filing Date:
May 20, 2021
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP)
International Classes:
C01B33/12; H01L23/29; H01L23/31
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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