Title:
SPLICED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/051225
Kind Code:
A1
Abstract:
A spliced circuit board, comprising a first circuit board body (1) and a second circuit board body (2). A first end surface (12) of the first circuit board body (1) is provided with a first plug connector; a first surface (22) of the second circuit board body (2) is provided with a second plug connector that matches and is fixed to the first plug connector; once the first plug connector and the second plug connector are matched and fixed, the first end surface (12) of the first circuit board body (1) is in contact with the first surface (22) of the second circuit board body (2), and a first surface (13) of the first circuit board body (1) is perpendicular to the first surface (22) of the second circuit board body (2). The first plug connector is provided on the first circuit board body (1), the second plug connector is provided on the second circuit board body (2), and a process of fixing the first circuit board body (1) and the second circuit board body (2) one to the other may be implemented by matching and fixing the first plug connector and the second plug connector. As a result, vertical splicing between the first circuit board body (1) and the second circuit board body (2) is achieved so that the shape of the circuit board is changed, which enables the circuit board to have a broader application range.
Inventors:
XIA YUANHONG (CN)
Application Number:
PCT/CN2019/105913
Publication Date:
March 25, 2021
Filing Date:
September 16, 2019
Export Citation:
Assignee:
SHENZHEN YAXINHONGDA ELECTRONIC TECH CO LTD (CN)
International Classes:
H05K1/14
Foreign References:
| CN201134974Y | 2008-10-15 | |||
| CN201134974Y | 2008-10-15 | |||
| CN207121998U | 2018-03-20 | |||
| CN206413258U | 2017-08-15 | |||
| CN208094903U | 2018-11-13 | |||
| US20130078825A1 | 2013-03-28 |
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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