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Patent Searching and Data


Title:
SPUTTERING TARGET-BACKING PLATE ASSEMBLY, METHOD FOR MANUFACTURING THE SAME, AND SPUTTERING TARGET RECOVERY METHOD
Document Type and Number:
WIPO Patent Application WO/2022/070881
Kind Code:
A1
Abstract:
The present disclosure provides a sputtering target-backing plate assembly that is configured: to suppress damage or peeling of a target even in a case where a target with low bending strength is used, or a case where the difference between the coefficients of linear expansion of the target and the backing plate differ significantly; to suppress contamination caused by volatilization of impurities; and to facilitate peeling/recovery of the target material while suppressing the loss of expensive materials used as the target material. The sputtering target-backing plate assembly according to the present disclosure comprises: a backing plate 1 that has a plate surface 3, a plate rear surface 4, a plate side surface 5, and a pressing surface 6; and a sputtering target 2 that has a target surface 7, a target rear surface 8 facing the plate surface 3, and a target side surface 9. The sputtering target 2 is fixed to the backing plate 1 by the target side surface 9 being pressed by the pressing surface 6.

Inventors:
MARUKO TOMOHIRO (JP)
SUZUKI YU (JP)
OTOMO SHOHEI (JP)
NAKAMURA HIRONOBU (JP)
Application Number:
PCT/JP2021/033682
Publication Date:
April 07, 2022
Filing Date:
September 14, 2021
Export Citation:
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Assignee:
FURUYA METAL CO LTD (JP)
International Classes:
C23C14/34; B23K20/00; G11B5/851
Foreign References:
JPH02243760A1990-09-27
JP2017002355A2017-01-05
JP2019056138A2019-04-11
Attorney, Agent or Firm:
IMASHITA, Katsuhiro et al. (JP)
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