Title:
STICKER TRANSFER ASSEMBLY SET AND STICKER TRANSFER METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/106023
Kind Code:
A1
Abstract:
Disclosed are a sticker transfer assembly set and a sticker transfer method using same. The sticker transfer assembly set, according to one embodiment of the present invention, comprises: a sticker which has decorations peelably adhering to a release sheet; and a transfer body which has an adhesion part where the decorations adhering to the release sheet adhere to when the upper surfaces of the decorations are contacted and pressurized, and which enables attaching the decorations to an object by means of contacting and pressurizing after peeling off the decorations from the release sheet.
Inventors:
KIM DONG SUNG (KR)
CHOI KYOUNG SIK (KR)
CHOI KYOUNG SIK (KR)
Application Number:
PCT/KR2017/014250
Publication Date:
June 14, 2018
Filing Date:
December 06, 2017
Export Citation:
Assignee:
JC KOREA CORP (KR)
International Classes:
A45D31/00; A44C15/00; A45D29/18; B32B7/06; B32B7/12; B44C3/02
Foreign References:
| KR101361040B1 | 2014-02-07 | |||
| KR20110016010A | 2011-02-17 | |||
| KR200338724Y1 | 2004-01-24 | |||
| KR101239735B1 | 2013-03-06 | |||
| KR101446506B1 | 2014-10-06 | |||
| KR101801962B1 | 2017-11-27 |
Other References:
See also references of EP 3443860A4
Attorney, Agent or Firm:
CHUNG HYUN PATENT & LAW FIRM (KR)
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