Title:
STRUCTURE AND METHOD FOR FABRICATION OF A LEADLESS CHIP CARRIER WITH EMBEDDED ANTENNA
Document Type and Number:
WIPO Patent Application WO2003010796
Kind Code:
B1
Abstract:
A substrate (120) has a top surfact (118) for receiving a semiconductor die.(110). An antenna is patterned on the bottom surface (124) of the substrate (120). The antenna is accessible by coupling it to a via (128) and, through the via (128) to a substrate signal bond (132) and a semiconductor die signal bond pad (104). In one embodiment, there is at least one via (128) in the substrate (120). The at least one via (128) provides an electrical connection between a signal bond pad of the semiconductor die (110) and the printed circuit board (150). The at least one via (128) also provides an electrical connection between the signal bond pad of the semiconductor die (110) and a land (144, 146) that is electrically connected to the printed circuit board (150).
Inventors:
COCCIOLI ROBERT
MEGAHED MOHAMED
HASSAN HASHEMI S
MEGAHED MOHAMED
HASSAN HASHEMI S
Application Number:
PCT/US2002/024080
Publication Date:
February 26, 2004
Filing Date:
July 26, 2002
Export Citation:
Assignee:
CONEXANT SYSTEMS INC (US)
International Classes:
H01L23/367; H01L23/12; H01L23/498; H01L23/64; H01L25/065; (IPC1-7): H01Q1/38
Download PDF: