Title:
STRUCTURE, METHOD FOR MANUFACTURING STRUCTURE, AND PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/095356
Kind Code:
A1
Abstract:
The present invention discloses a structure that has good characteristics as a material of a frame or the like in a processing device, a method for manufacturing said structure, and a processing device in which said structure is used. This structure (CFRP structure) (10) comprises: a stacked body (CFRP member) (11) having carbon fibers as a main component; and metal foils (12a, 12b) that are subjected to thermal press bonding and thereby respectively integrated onto a pair of surfaces (11a, 11b) that face each other in the stacking direction of the stacked body (11), the metal foils having a metal as a main component. The thicknesses of the metal foils (12a, 12b) are less than the thickness of the stacked body (11).
Inventors:
NAKATA SHIGENORI (JP)
WATANABE YOSHIMITSU (JP)
WATANABE YOSHIMITSU (JP)
Application Number:
PCT/JP2022/011536
Publication Date:
June 01, 2023
Filing Date:
March 15, 2022
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
ADTEC ENG CO LTD (JP)
ADTEC ENG CO LTD (JP)
International Classes:
B29C43/20; B32B5/10; B29C70/34; B32B15/08
Foreign References:
| JP2000317965A | 2000-11-21 | |||
| JP2019136889A | 2019-08-22 | |||
| JP2017080899A | 2017-05-18 | |||
| JPH11245899A | 1999-09-14 |
Attorney, Agent or Firm:
KONISHI, Kay et al. (JP)
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