SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

Title:

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

Document Type and Number:

WIPO Patent Application WO/2022/230199

Kind Code:

A1

Abstract:

This substrate bonding apparatus comprises a first holding mechanism that holds a first substrate, a second holding mechanism that holds a second substrate and can change the distance between the first substrate and the second substrate, a load detection mechanism detecting a load that is based on the surface tension and acts between the first substrate and the second substrate, and a drive mechanism that controls the distance between the first substrate and the second substrate on the basis of the detection value of the load detection mechanism.

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Inventors:

HONDA MASASHI (JP)

Application Number:

PCT/JP2021/017271

Publication Date:

November 03, 2022

Filing Date:

April 30, 2021

Export Citation:

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Assignee:

OLYMPUS CORP (JP)

International Classes:

C09J5/00

Foreign References:

JP2002512379A	2002-04-23
JP2003225852A	2003-08-12
JP2002251804A	2002-09-06
JP2005333005A	2005-12-02