Title:
SUBSTRATE BONDING STRUCTURE AND SUBSTRATE BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/176095
Kind Code:
A1
Abstract:
According to the present invention, a device (2) is formed on a main surface of a substrate (1). The main surface of the substrate (1) and the lower surface of a facing substrate (14) are bonded in a hollow state via bonding members (11, 12, 13). A circuit (17) and a bump structure (26) are formed on the upper surface of the facing substrate (14). The bump structure (26) is disposed in at least a region corresponding to the bonding members (11, 12, 13) and is higher than the circuit (17).
Inventors:
NISHIZAWA KOICHIRO (JP)
Application Number:
PCT/JP2018/010522
Publication Date:
September 19, 2019
Filing Date:
March 16, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/02
Foreign References:
| JP2004209585A | 2004-07-29 | |||
| JP2005262382A | 2005-09-29 | |||
| JP2015174150A | 2015-10-05 | |||
| US20150353348A1 | 2015-12-10 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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