SUBSTRATE CONNECTION MEMBER COMPRISING SUBSTRATE HAVING OPENING PART, WHICH ENCOMPASSES REGION IN WHICH THROUGH WIRE IS FORMED, AND CONDUCTIVE MEMBER FORMED ON SIDE SURFACE OF OPENING PART, AND ELECTRONIC DEVICE COMPRISING SAME

Title:

Document Type and Number:

WIPO Patent Application WO/2020/085719

Kind Code:

A1

Abstract:

A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.

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Inventors:

PARK SUNGCHUL (KR)
HA SANGWON (KR)
PARK CHULWOO (KR)

Application Number:

PCT/KR2019/013724

Publication Date:

April 30, 2020

Filing Date:

October 18, 2019

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

H04M1/02; H04B1/40

Foreign References:

CN108538811A	2018-09-14
CN202178922U	2012-03-28
KR101126548B1	2012-03-22
US20070125570A1	2007-06-07
US20110019372A1	2011-01-27

Other References: