Title:
SUBSTRATE HEATING DEVICE, SUBSTRATE HEATING METHOD, COATING DEVICE, AND COATING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/007988
Kind Code:
A1
Abstract:
Provided are a substrate heating device, a substrate heating method, a coating device, and a coating method, whereby it is possible to prevent rupture of a substrate after heating. Specifically, the present invention comprises: a heating unit 10 that allows a strip-shaped substrate 2 continuously conveyed along a predetermined conveyance path to pass therethrough, and heats the substrate 2 at that time; and a temperature drop suppression unit that is located on the exit side of the heating unit 10 in the conveyance path and suppresses a temperature drop at least at the edge in the width direction of the substrate 2 discharged from the heating unit 10.
Inventors:
IWADE TAKASHI (JP)
ARAI YOSHIYUKI (JP)
WADA HIROMITSU (JP)
NANRI KAZUKI (JP)
MOTOI MASASHI (JP)
WATANABE ATSUSHI (JP)
ARAI YOSHIYUKI (JP)
WADA HIROMITSU (JP)
NANRI KAZUKI (JP)
MOTOI MASASHI (JP)
WATANABE ATSUSHI (JP)
Application Number:
PCT/JP2022/024635
Publication Date:
February 02, 2023
Filing Date:
June 21, 2022
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
F26B13/06; B05C9/14; B05D3/00; B05D3/02; B05D7/00; F26B9/06; H01M4/139; H01M4/66
Foreign References:
| JP2017081164A | 2017-05-18 | |||
| JP2019163903A | 2019-09-26 | |||
| JP2017091726A | 2017-05-25 | |||
| JP2013253729A | 2013-12-19 | |||
| JP2015219983A | 2015-12-07 | |||
| JP2010101595A | 2010-05-06 | |||
| JP2014161783A | 2014-09-08 |
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