Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE HOLDING DEVICE AND METHOD OF MANUFACTURING DRIVE RING
Document Type and Number:
WIPO Patent Application WO/2019/187814
Kind Code:
A1
Abstract:
The present invention relates to a substrate holding device for use in polishing a surface of a substrate by pressing the substrate against a polishing tool, such as a polishing pad. The present invention also relates to a method of manufacturing a drive ring used in the substrate holding device. The substrate holding device (1) is provided with: a polishing head body (10); a drive ring (81) disposed under the polishing head body (10); and a retainer ring (40) fixed to the drive ring (81). The drive ring (81) includes an annular contact surface (81a) that contacts the retainer ring (40), wherein the contact surface (81a) has a flatness in a circumferential direction of less than or equal to 4.6 μm. The flatness indicates a height difference between a highest position and a lowest position of the contact surface (81a).

Inventors:
NAMIKI KEISUKE (JP)
FUKUSHIMA MAKOTO (JP)
NABEYA OSAMU (JP)
Application Number:
PCT/JP2019/006313
Publication Date:
October 03, 2019
Filing Date:
February 20, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/32; H01L21/304
Domestic Patent References:
WO2006038259A12006-04-13
WO2006114854A12006-11-02
Foreign References:
JP2017074639A2017-04-20
JP2007266068A2007-10-11
JP2008023603A2008-02-07
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
Download PDF: