Title:
SUBSTRATE HOLDING DEVICE AND SOLDER PRINTING MACHINE
Document Type and Number:
WIPO Patent Application WO/2022/059178
Kind Code:
A1
Abstract:
This substrate holding device comprises: a substrate conveying unit that conveys a substrate in and along the conveying path; a clamp rail that is positioned above the conveying path and that can hold the substrate; a backup table that is positioned below the conveying path and that can be raised and lowered; a backup block of which the length in a horizontal plane in a first direction is formed longer than the backup table, which is placed on the backup table, and which pushes up the substrate and holds the substrate on the clamp rail as the backup table rises; and a regulatory unit that regulates the movement of the backup block in the first direction with respect to the backup table.
Inventors:
MATSUZAKI NAOKI (JP)
Application Number:
PCT/JP2020/035505
Publication Date:
March 24, 2022
Filing Date:
September 18, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
B41F15/26; B41F15/08; H05K3/34
Domestic Patent References:
| WO2018193773A1 | 2018-10-25 | |||
| WO2017022109A1 | 2017-02-09 | |||
| WO2014091546A1 | 2014-06-19 |
Foreign References:
| JP2010149503A | 2010-07-08 | |||
| JPH0752358A | 1995-02-28 | |||
| KR20140121250A | 2014-10-15 |
Attorney, Agent or Firm:
KYORITSU INTERNATIONAL (JP)
Download PDF: