Title:
SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/117493
Kind Code:
A1
Abstract:
Provided is a technology advantageous for improving uniformity of substrate liquid processing. This substrate liquid processing method includes: a step for supplying a processing liquid to a substrate held by a substrate holding part and forming a liquid film of the processing liquid; and a step for irradiating a substrate, which has the liquid film of the processing liquid formed thereon, with a sound wave via a gas in the surroundings of the substrate to vibrate the substrate.
Inventors:
NISHIKIDO SHUUICHI (JP)
MATSUOKA NOBUAKI (JP)
MATSUOKA NOBUAKI (JP)
Application Number:
PCT/JP2020/043949
Publication Date:
June 17, 2021
Filing Date:
November 26, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B08B3/02; H01L21/304; H01L21/306
Foreign References:
| JP2001307994A | 2001-11-02 | |||
| KR20180060026A | 2018-06-07 | |||
| JP2015005567A | 2015-01-08 | |||
| US20020108631A1 | 2002-08-15 | |||
| JP2015126167A | 2015-07-06 | |||
| JP2014017466A | 2014-01-30 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
Download PDF: