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Patent Searching and Data


Title:
SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/145923
Kind Code:
A1
Abstract:
This invention has an electroconductive substrate that can be removed after a semiconductor element is mounted, a semiconductor element-mounting region provided on a surface of the electroconductive substrate, and a lead part comprising a plating layer provided on a predetermined region on the surface of the electroconductive substrate around the semiconductor element-mounting region. The lead part has: a lower level part, which has side surfaces substantially perpendicular to the surface of the electroconductive substrate and which extend upwards in a columnar shape from the surface; and an upper level part, which has a bottom surface on the upper surface of the lower level part and which has side surfaces extending upwards and sideways from the bottom surface in a tapered shape.

Inventors:
ARIMA HIROYUKI (JP)
Application Number:
PCT/JP2017/005832
Publication Date:
August 31, 2017
Filing Date:
February 17, 2017
Export Citation:
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Assignee:
SH MATERIALS CO LTD (JP)
International Classes:
H01L23/12; H01L23/28; H01L33/52; H01L33/62
Foreign References:
US20140167236A12014-06-19
JP2010219497A2010-09-30
JP2009290180A2009-12-10
JP2001274290A2001-10-05
JP2001024112A2001-01-26
JP2014522130A2014-08-28
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
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