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Patent Searching and Data


Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/002801
Kind Code:
A1
Abstract:
A substrate processing apparatus A1 comprises: a cup 1 capable of holding a processing fluid 92 for processing a substrate 91; a stage 2 capable of being lifted and lowered along a lifting/lowering shaft 31 extending in a vertical direction z in the cup 1; a mounting base 4 provided on the stage 2 to mount the substrate 91; and a pivot member 5 which is mounted pivotally with respect to the mounting base 4 around a pivot shaft 51, the pivot shaft 51 extending along a circumferential direction θ about the lifting/lowering shaft 31. The pivot member 5 includes a holding portion 52 positioned on the inside of the pivot shaft 51 in a radial direction r, and an abutting portion 53 positioned on the outside of the pivot shaft 51 in the radial direction r. As the stage 2 is lowered, the abutting portion 53 abuts on the cup 1 to pivot the pivot member 5, whereby the interval between the holding portion 52 and the mounting base 4, with the substrate 91 sandwiched therebetween, decreases. This configuration makes it possible to reduce unintended impacts on the processing being performed on the substrate 91.

Inventors:
USHIDA SATOSHI (JP)
SAITO KENICHIRO (JP)
Application Number:
PCT/JP2022/025265
Publication Date:
January 26, 2023
Filing Date:
June 24, 2022
Export Citation:
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Assignee:
TOHO KASEI CO LTD (JP)
International Classes:
H01L21/306; H01L21/683
Foreign References:
JP2017147354A2017-08-24
JPH11111822A1999-04-23
JP2015188008A2015-10-29
JP2014036168A2014-02-24
JP2017147354A2017-08-24
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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