Title:
SUBSTRATE PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2023/008124
Kind Code:
A1
Abstract:
According to the present invention, a coating/developing device is provided with: a removing liquid nozzle that discharges a removing liquid to the periphery of a substrate; a flow passage that is a processing liquid supply passage for allowing the removing liquid to flow between a supply source of the removing liquid and the removing liquid nozzle; an image capturing unit of an inspection unit, the image capturing unit capturing an image of the periphery of the substrate; various sensors, serving as an observation unit, that are provided in the flow passage and that observe the flowing state of the removing liquid in the flow passage; and an analysis unit that identifies an abnormal factor related to the supply of the removing liquid to a substrate W on the basis of the image captured by the image capturing unit of the inspection unit and the result of observation by the various sensors.
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Inventors:
SHIMOAOKI TAKESHI (JP)
NAKANO HIBIKI (JP)
NAKANO HIBIKI (JP)
Application Number:
PCT/JP2022/026855
Publication Date:
February 02, 2023
Filing Date:
July 06, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B05C11/08; H01L21/027
Domestic Patent References:
WO2020250306A1 | 2020-12-17 |
Foreign References:
JP2016178238A | 2016-10-06 | |||
JP2013055191A | 2013-03-21 | |||
JP2018032766A | 2018-03-01 | |||
JP2004179211A | 2004-06-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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