Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/141738
Kind Code:
A1
Abstract:
In this substrate processing device, substrate charge removal is carried out by a charge removal device provided in a heating portion. In the charge removal device OWE, among a holding portion (434) holding the substrate W and an emitting portion (300) whereby vacuum ultraviolet rays are emitted, at least one moves in one direction relative to the other. In so doing, the vacuum ultraviolet rays emitted by the emitting portion are irradiated upon one surface of the substrate. The charge removal is completed with the entirety of the one surface of the substrate being irradiated by the vacuum ultraviolet rays. Thereafter, the substrate that has undergone the charge removal is transported to a coating processing unit in a coating processing portion. In the coating processing unit, a film of processing solution is formed on the one surface of the substrate that has undergone the charge removal.

Inventors:
WAJIKI TAKEHIRO (JP)
MIYAGI TADASHI (JP)
MITSUHASHI TSUYOSHI (JP)
Application Number:
PCT/JP2017/004036
Publication Date:
August 24, 2017
Filing Date:
February 03, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/027; B05C9/10; B05D3/06; H01L21/677
Domestic Patent References:
WO2012026482A12012-03-01
Foreign References:
JP2001358094A2001-12-26
JP2001179198A2001-07-03
JP2002143747A2002-05-21
JP2005279376A2005-10-13
JP2011256249A2011-12-22
JP2006209937A2006-08-10
JPH11267597A1999-10-05
Attorney, Agent or Firm:
FUKUSHIMA, Yoshito (JP)
Yoshihito Fukushima (JP)
Download PDF: