Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/117376
Kind Code:
A1
Abstract:
The present invention pertains to a substrate processing device and a substrate processing method which are for processing a substrate such as a wafer. This substrate processing device (1) comprises: a substrate holding part (2); a polishing head (13); and a peripheral edge section cleaning mechanism (50) for supplying a cleaning fluid to a peripheral edge section of a substrate (W) when polishing and cleaning the peripheral section of the substrate (W).
Inventors:
UCHIYAMA KEISUKE (JP)
NAKANISHI MASAYUKI (JP)
NAKANISHI MASAYUKI (JP)
Application Number:
PCT/JP2020/041036
Publication Date:
June 17, 2021
Filing Date:
November 02, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B21/18; B24B9/00; B24B21/00; B24B55/04; B24B55/06; H01L21/304
Foreign References:
| JP2018161721A | 2018-10-18 | |||
| JP2004050384A | 2004-02-19 | |||
| JPH09186234A | 1997-07-15 | |||
| JP2018114582A | 2018-07-26 | |||
| JP3210528U | 2017-05-25 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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