Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/179685
Kind Code:
A1
Abstract:
A substrate processing device having a substrate polishing unit 40 provided with a polishing pad for polishing a wafer W, and a top ring 41 for holding the wafer and pushing the wafer toward the polishing pad. An elastic film 80 that holds a surface of the wafer W on the side opposite from the polishing surface is attached as an expendable component to the top ring 41. A plurality of distortion sensors 85, 86 that measure distortion occurring in the elastic film 80 during polishing are provided to the elastic film 80, and data of a distortion amount is read out to a control device 15 by detection units 90, 91. The control device 15 sets process conditions such as a polishing recipe for the wafer W on the basis of distortion information of the elastic film 80 measured by the distortion sensors.
Inventors:
NAMIKI KEISUKE (JP)
FUKUSHIMA MAKOTO (JP)
FUKUSHIMA MAKOTO (JP)
Application Number:
PCT/JP2018/000912
Publication Date:
October 04, 2018
Filing Date:
January 16, 2018
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B23Q15/16; B24B37/30; B24B49/10; H01L21/02
Domestic Patent References:
| WO2000045993A1 | 2000-08-10 |
Foreign References:
| JP2011194509A | 2011-10-06 | |||
| JP2008310404A | 2008-12-25 | |||
| JP2014223684A | 2014-12-04 | |||
| JP2009542449A | 2009-12-03 | |||
| JP2014011432A | 2014-01-20 | |||
| JP2015051501A | 2015-03-19 | |||
| JP2001009712A | 2001-01-16 |
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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