Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/129757
Kind Code:
A1
Abstract:
This substrate processing device is provided with a polishing unit including: a polishing head (75) for polishing the main surface of a wafer W; a rotation drive part (82) for rotating the polishing head (75) around an axial line Ax1; and a rotation drive part (84) for moving the axial line Ax1 along a circular orbit around an axial line Ax2 parallel to the axial line Ax1. The center position of the polishing head (75) is different from the axial line Ax1. The outer diameter of the polishing head (75) is smaller than the movable-range diameter of the polishing head (75) around the axial line Ax1.
Inventors:
KUBO AKIHIRO (JP)
TAKIGUCHI YASUSHI (JP)
OKAMOTO YOSHIKI (JP)
HOSAKA HAYATO (JP)
KODAMA TERUHIKO (JP)
TAKIGUCHI YASUSHI (JP)
OKAMOTO YOSHIKI (JP)
HOSAKA HAYATO (JP)
KODAMA TERUHIKO (JP)
Application Number:
PCT/JP2019/048343
Publication Date:
June 25, 2020
Filing Date:
December 10, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B7/04; B24B47/16; H01L21/027; H01L21/304
Domestic Patent References:
| WO1994009944A1 | 1994-05-11 |
Foreign References:
| JPH0373261A | 1991-03-28 | |||
| JP2018093178A | 2018-06-14 | |||
| JPH10329012A | 1998-12-15 | |||
| JP2009000783A | 2009-01-08 | |||
| JP2017522733A | 2017-08-10 | |||
| JP2009214253A | 2009-09-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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