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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/179804
Kind Code:
A1
Abstract:
This substrate processing device is provided with a polishing part and a transport part. The polishing part has a first polishing unit and second polishing unit, and a polishing part conveyance mechanism. The first polishing unit has a first polishing device and second polishing device. The second polishing unit has a third polishing device and fourth polishing device. The first through fourth polishing devices each have a polishing table where a polishing pad is attached, a top ring, and an auxiliary unit for performing processing on the polishing pad mid-polishing. Provided in the area surrounding the polishing table, at locations of left/right symmetry with respect to a straight line joining a center of swing of the top ring and a center of rotation of the polishing table, is a pair of auxiliary unit attachment parts for attaching the auxiliary unit so as to enable left/right switching with respect to the straight line.

Inventors:
YAMAGUCHI KUNIAKI (JP)
SHIMOMOTO HIROSHI (JP)
ISOBE SOICHI (JP)
MAEDA KOJI (JP)
SHINKAI KENJI (JP)
ISOKAWA HIDETATSU (JP)
YOSHINARI DAI (JP)
TAMURA MASAYUKI (JP)
HAIYANG XU (JP)
EHARA SHUN (JP)
ASANO KENTARO (JP)
Application Number:
PCT/JP2020/009018
Publication Date:
September 10, 2020
Filing Date:
March 04, 2020
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B37/00; B24B37/013; B24B53/017; H01L21/304
Domestic Patent References:
WO2002034467A12002-05-02
Foreign References:
JP2018006549A2018-01-11
JP2019029562A2019-02-21
JP2018058197A2018-04-12
JP2016074048A2016-05-12
JPH10264011A1998-10-06
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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