Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/026719
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing method and a substrate processing apparatus with which cracking and chipping of a laminated substrate manufactured by bonding a plurality of substrates are suppressed, and more specifically to a technology for applying a filler to a gap formed between edge portions of the plurality of substrates constituting the laminated substrate. This method comprises: applying a filler (F) to a gap between an edge portion (E1) of a first substrate (W1) and an edge portion (E2) of a second substrate (W2); curing the applied filler (F); generating, with an infrared imaging device (5), an image of an edge portion of a laminated substrate (Ws) to which the filler (F) has been applied; and determining the filling state of the filler (F) applied to the gap between the edge portion (E1) of the first substrate (W1) and the edge portion (E2) of the second substrate (W2) on the basis of the image.
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Inventors:
SATAKE MASAYUKI (JP)
NAKANISHI MASAYUKI (JP)
NAKANISHI MASAYUKI (JP)
Application Number:
PCT/JP2022/027660
Publication Date:
March 02, 2023
Filing Date:
July 14, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B05D3/00; B05C5/00; B05C9/14; B05D7/00
Domestic Patent References:
| WO2009097494A1 | 2009-08-06 |
Foreign References:
| JP2012216589A | 2012-11-08 | |||
| JP2016051779A | 2016-04-11 | |||
| JP2012042431A | 2012-03-01 | |||
| JP2006278807A | 2006-10-12 | |||
| US20090079038A1 | 2009-03-26 | |||
| JPH05304062A | 1993-11-16 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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