Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/195474
Kind Code:
A1
Abstract:
This substrate processing method comprises: a step (step S105) in which, at a first processing part, after a wet process (step S104) has been performed on a substrate that has a pattern of recesses and protrusions formed on the surface thereof, the surface of the substrate is coated with a liquid film that includes an organic solvent, and at least the surface of the liquid film is solidified to form a solidified film; steps (steps S106, S107) in which the substrate that is coated with the solidified film is transported to a second processing part; and a step (step S108) in which, at the second processing part, a dissolution liquid is supplied to the solidified film to dissolve the solidified film, and the dissolution liquid is removed from the surface of the substrate to dry the substrate. The present invention makes it possible to ensure easy transport between processing units while reliably preventing collapse of the pattern of recesses and protrusions formed on the surface of the substrate.
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Inventors:
TAKAHASHI HIROAKI (JP)
SHIRAKAWA HAJIME (JP)
SHIRAKAWA HAJIME (JP)
Application Number:
PCT/JP2020/007669
Publication Date:
October 01, 2020
Filing Date:
February 26, 2020
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
F26B21/14; H01L21/304
Foreign References:
| JP2019029491A | 2019-02-21 | |||
| JP2019046942A | 2019-03-22 | |||
| JP2018163992A | 2018-10-18 | |||
| JP2015050414A | 2015-03-16 | |||
| JP2012074564A | 2012-04-12 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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