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Patent Searching and Data


Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/199565
Kind Code:
A1
Abstract:
The present invention replaces the liquid adhering to a substrate with high replacement efficiency by processing fluid while preventing contamination of the substrate caused by the generation of a gas-liquid interface in a supercritical drying process. To achieve this, this substrate processing method comprises: a first step (step S104) for introducing gas-phase processing fluid into a chamber containing the substrate; a second step (step S105) for changing the processing fluid in the chamber from the gas phase to the supercritical state without going through the liquid phase; a third step (step S106) for changing the processing fluid in the chamber from the supercritical state to the liquid phase; a fourth step (step S107) for changing the processing fluid in the chamber from the liquid phase to the supercritical state; and a fifth step (step S108) in which the processing fluid in the chamber is changed from the supercritical state to the gas phase without going through the liquid phase and discharged from the chamber.

Inventors:
YAMAGUCHI YUJI (JP)
Application Number:
PCT/JP2021/000812
Publication Date:
October 07, 2021
Filing Date:
January 13, 2021
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
F26B7/00; H01L21/304
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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