Title:
SUBSTRATE PROCESSING METHOD, STORAGE MEDIUM, AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/185921
Kind Code:
A1
Abstract:
A substrate processing method according to one aspect of the present disclosure comprises: supplying a developer solution (L1) to a surface (Wa) of a substrate (W) so as to form a liquid film of the developer solution on the surface of the substrate; retaining the liquid film of the developer solution on the surface of the substrate so as to advance the development on the surface of the substrate; and, while retaining the liquid film of the developer solution so as to advance the development, supplying an adjustment liquid (L2) for suppressing the advancement of the development to a peripheral region of the surface of the substrate, so that the degree of the development is adjusted between the peripheral region and an inner region inward of the peripheral region.
Inventors:
MIYAKUBO YUSUKE (JP)
NISHIYA AKIRA (JP)
YOSHIHARA KENTARO (JP)
NISHIYA AKIRA (JP)
YOSHIHARA KENTARO (JP)
Application Number:
PCT/JP2022/006214
Publication Date:
September 09, 2022
Filing Date:
February 16, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B05C11/08; B05C5/00; B05C11/10; B05D1/26; B05D1/36; B05D1/40; B05D3/00; B05D3/10; B05D7/00; H01L21/027
Foreign References:
| JP2003332228A | 2003-11-21 | |||
| JP2003151895A | 2003-05-23 | |||
| JP2010182931A | 2010-08-19 | |||
| JPH1092719A | 1998-04-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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