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Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/262039
Kind Code:
A1
Abstract:
Provided is a substrate processing method for processing a substrate, the method including: a step of supplying an application liquid on a layer to be processed of the substrate and forming an organic film containing carbon; a step of heat processing the substrate on which the organic film has been formed; a step of subjecting the organic film after heating processing to a predetermined process of cutting the bonds between carbons in the organic film, moving the carbons for which the bond has been cut within the organic film, and recombining the carbons with other carbons; and a step of supplying a resist liquid onto the organic film that has been subjected to the predetermined process to form a resist film.

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Inventors:
OKADA SOICHIRO (JP)
SHIMURA SATORU (JP)
Application Number:
PCT/JP2020/023189
Publication Date:
December 30, 2020
Filing Date:
June 12, 2020
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B05D1/38; B05D3/02; B05D7/24; G03F7/11; G03F7/16; H01L21/027; H01L21/3065
Foreign References:
JP2007335450A2007-12-27
JP2010219491A2010-09-30
JP2013030801A2013-02-07
JP2014096499A2014-05-22
JP2008242221A2008-10-09
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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