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Patent Searching and Data


Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/070756
Kind Code:
A1
Abstract:
This substrate processing method includes: a step (a) for performing wet development on a metal-containing resist of a substrate; and a step (b) for performing dry development on the metal-containing resist. The metal-containing resist includes a first region that has been exposed to light and a second region that has not been exposed to light. In the step (a), one region among the first region and the second region is partially removed in the thickness direction of said one region. In the step (b), the remainder of the one region is removed.

Inventors:
KUMAKURA SHO (JP)
ONO KENTA (JP)
NAKANE YUTA (JP)
NISHIZUKA TETSUYA (JP)
HONDA MASANOBU (JP)
Application Number:
PCT/JP2023/033670
Publication Date:
April 04, 2024
Filing Date:
September 15, 2023
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G03F7/30; H01L21/027
Domestic Patent References:
WO2022010809A12022-01-13
WO2022016126A12022-01-20
Foreign References:
JP2022013909A2022-01-18
JP2022538040A2022-08-31
JP2020129607A2020-08-27
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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