Title:
SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2019/124032
Kind Code:
A1
Abstract:
A substrate processing system that machines a machining face of a substrate on which a protective material is provided on a non-machining face has: a grinding unit that grinds the machining face of the substrate in a plurality of steps; a protective material thickness measuring unit that measures the thickness of the protective material before grinding the substrate machining face with the grinding unit; and a controlling unit that calculates, on the basis of the protective material thickness measured by the protective material thickness measuring unit, a first grinding amount during a first grinding step so that a second grinding amount during a second grinding step after the first grinding step, in which the machining face of the substrate is ground with the grinding unit, is constant for each substrate.
Inventors:
KODAMA MUNEHISA (JP)
Application Number:
PCT/JP2018/044366
Publication Date:
June 27, 2019
Filing Date:
December 03, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B49/02; B24B7/04; B24B49/10; H01L21/304
Foreign References:
| JP2010199227A | 2010-09-09 | |||
| JP2011245610A | 2011-12-08 | |||
| JP2010040821A | 2010-02-18 | |||
| JP2007335458A | 2007-12-27 | |||
| JP2017056523A | 2017-03-23 | |||
| JP2016132047A | 2016-07-25 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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