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Patent Searching and Data


Title:
SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/044506
Kind Code:
A1
Abstract:
A substrate processing system comprises: an ultraviolet irradiation portion that irradiates ultraviolet rays on a protective tape that protects a substrate; a mounting unit that mounts the substrate on a frame interposed by an adhesive tape that is provided on the reverse side to the protective tape after ultraviolet irradiation using the substrate as a reference; and a peeling part that peels the protective tape from the substrate mounted on the frame with the adhesive tape interposed therebetween. The ultraviolet irradiation portion is provided overlapping the mounting unit in the vertical direction of the mounting unit.

Inventors:
TAMURA TAKESHI (JP)
Application Number:
JP2018/030350
Publication Date:
March 07, 2019
Filing Date:
August 15, 2018
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/683; H01L21/02; H01L21/301; H01L21/677
Foreign References:
JP2007214457A2007-08-23
JP2005297457A2005-10-27
JP2004186682A2004-07-02
JP2007324516A2007-12-13
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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