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Patent Searching and Data


Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/208337
Kind Code:
A1
Abstract:
Provided is a substrate processing system provided with: a carrying in and out station through which a cassette that stores a substrate to be processed is carried in and out; a laser processing device which performs a laser process on the substrate to be processed; and a thinning device which makes the substrate to be processed thin, wherein the thinning device and the carrying in and out station are arranged at opposite sides with the laser processing device therebetween in a horizontal direction.

Inventors:
KAWAGUCHI YOSHIHIRO (JP)
MORI HIROTOSHI (JP)
HISANO KAZUYA (JP)
Application Number:
PCT/JP2019/016369
Publication Date:
October 31, 2019
Filing Date:
April 16, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; B23K26/60; B24B7/04; H01L21/301; H01L21/304
Foreign References:
JP2007235069A2007-09-13
JP2015082642A2015-04-27
JP2012124300A2012-06-28
JP2005508085A2005-03-24
JP2009049233A2009-03-05
JP2018166177A2018-10-25
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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