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Patent Searching and Data


Title:
SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/239801
Kind Code:
A1
Abstract:
A substrate processing system comprising: a thickness-reducing device that reduces the thickness of a substrate to be processed; a segmenting device that segments the reduced-thickness substrate to be processed into a plurality of chips; an etching device that etches the reduced-thickness surface of the chip and the segmented surface of the chip; a gettering-layer-formation device that forms a gettering layer on the surface of the chip that has been reduced in thickness and etched, or in the interior of the chip at a prescribed depth from the surface of the chip that has been reduced in thickness and etched; a conveying device that conveys the substrate to be processed to the thickness-reducing device, the segmenting device, the etching device, and the gettering-layer-formation device; and a control device that controls the thickness-reducing device, the segmenting device, the etching device, the gettering-layer-forming device, and the conveying device.

Inventors:
TANOUE HAYATO (JP)
Application Number:
PCT/JP2019/019883
Publication Date:
December 19, 2019
Filing Date:
May 20, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/322; B24B7/04; B24B27/06; H01L21/301; H01L21/304; H01L21/306
Foreign References:
JP2017092135A2017-05-25
JP2013157449A2013-08-15
JP2011155069A2011-08-11
JP2010161107A2010-07-22
JP2007165835A2007-06-28
JP2007109838A2007-04-26
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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