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Patent Searching and Data


Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/039802
Kind Code:
A1
Abstract:
This substrate processing system is equipped with: a first principal surface grinding device which holds a substrate from below in a manner such that the first principal surface of the substrate is oriented upward, and grinds the first principal surface of the substrate; a first flipping device for vertically flipping the substrate subjected to grinding by the first principal surface grinding device; and a second principal surface grinding device which holds the ground first principal surface of the substrate from below in a manner such that the second principal surface of the substrate is oriented upward, and grinds the second principal surface of the substrate.

Inventors:
KODAMA MUNEHISA (JP)
Application Number:
PCT/JP2019/028108
Publication Date:
February 27, 2020
Filing Date:
July 17, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; B08B1/04; B24B7/04; B24B41/047; H01L21/677
Domestic Patent References:
WO2017134925A12017-08-10
Foreign References:
JP2005205543A2005-08-04
JP2003260662A2003-09-16
JP2016018901A2016-02-01
JP2015039755A2015-03-02
JP2015026728A2015-02-05
JP2018039070A2018-03-15
JP2006269761A2006-10-05
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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