Title:
SUBSTRATE REINFORCING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2014/141990
Kind Code:
A1
Abstract:
[Problem] To provide a substrate reinforcing structure for preventing/suppressing deformation or the like of a substrate to which a socket for an electrical component is affixed.
[Solution] For example, a frame-like first reinforcing plate is fitted to the back surface of a wiring board. Additionally, for example, a plate-like second reinforcing plate is provided on the back surface of the first reinforcing plate. In a preferred embodiment of the present invention, a first insulating sheet is additionally provided between the wiring board and the first reinforcing plate; a spacer is provided on the second reinforcing plate so as to be in contact with a portion of the wiring board, in said portion no contact pin protruding; and a second insulating sheet is additionally provided on the second reinforcing plate.
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Inventors:
UEYAMA YUKI (JP)
Application Number:
PCT/JP2014/055735
Publication Date:
September 18, 2014
Filing Date:
March 06, 2014
Export Citation:
Assignee:
ENPLAS CORP (JP)
International Classes:
H05K1/02; G01R31/26; H01R33/76; H05K1/18
Foreign References:
| JPH072981U | 1995-01-17 | |||
| JP2003086279A | 2003-03-20 | |||
| JPH036892U | 1991-01-23 | |||
| JPH0633089U | 1994-04-28 | |||
| JPH0763817A | 1995-03-10 |
Attorney, Agent or Firm:
SANO, Hiroshi et al. (JP)
Sano 弘 (JP)
Sano 弘 (JP)
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