Title:
SUBSTRATE STRUCTURE, AND MOBILE TERMINAL
Document Type and Number:
WIPO Patent Application WO/2008/010261
Kind Code:
A1
Abstract:
Provided are a substrate structure, which can improve the adhesion between a
wall portion defining a frame inside and a resin and which does not impair the shielding
property of electronic parts to be used for radio communications, and a mobile
terminal. The substrate structure (10) includes a substrate (11), a plurality
of electronic parts (12) mounted along one mounting face (11A) of the substrate
(11), a frame (13) enclosing the individual electronic parts (12), a wall portion
(14) partitioning the inside of the frame (13), and a resin portion (15) filled
in the frame (13) to cover the individual electronic parts (12) and closely adhered
to the mounting face (11A) of the substrate (11). This substrate structure (10)
has a through hole (16) extending through the wall portion (14) in the thickness
direction, and the through hole (16) has a maximum opening size (D) matching the
frequency, which is used by such electronic parts (12A) of the individual electronic
parts (12) as are used for the radio communications.
Inventors:
HAYAKAWA HARUO
Application Number:
PCT/JP2006/314167
Publication Date:
January 24, 2008
Filing Date:
July 18, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
HAYAKAWA HARUO
HAYAKAWA HARUO
International Classes:
H01L25/04; H01L23/28; H01L25/18
Foreign References:
| JP2003332500A | 2003-11-21 | |||
| JPH0521701A | 1993-01-29 | |||
| JPH01123349U | 1989-08-22 | |||
| JPH01169036U | 1989-11-29 |
Attorney, Agent or Firm:
ICHIKAWA, Toshimitsu et al. (7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, JP)
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