Title:
SUBSTRATE SUPPORT AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/054508
Kind Code:
A1
Abstract:
Provided is a substrate support having: a base; an electrostatic chuck on which a substrate is mounted; an electrode which is provided to the electrostatic chuck; a contact of the electrode; an adhesive layer that is disposed on the base so as to bond the electrostatic chunk to the base and that does not cover the contact; and a power supply terminal which comes into contact with the electrode contact without being fixed thereto.
Inventors:
NAGAYAMA AKIRA (JP)
SASAKI YASUHARU (JP)
TOMIOKA TAKETOSHI (JP)
YAMAGUCHI SHIN (JP)
SASAKI YASUHARU (JP)
TOMIOKA TAKETOSHI (JP)
YAMAGUCHI SHIN (JP)
Application Number:
PCT/JP2019/034582
Publication Date:
March 19, 2020
Filing Date:
September 03, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; H01L21/683; H02N13/00; H05H1/46
Foreign References:
JP2018082161A | 2018-05-24 | |||
JP2016051783A | 2016-04-11 | |||
JPH07161803A | 1995-06-23 | |||
JP2015207765A | 2015-11-19 | |||
JP2017022284A | 2017-01-26 | |||
JP2001210450A | 2001-08-03 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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