Title:
SUBSTRATE TREATING DEVICE AND SUBSTRATE TREATING METHOD
Document Type and Number:
WIPO Patent Application WO/2003/021657
Kind Code:
A1
Abstract:
A substrate treating device and a substrate treating method capable of forming an oxide film thinner than conventional ones and uniform in thickness when forming an oxide film on the surface of a substrate. A substrate treating device (12) for supplying a treatment liquid to a substrate (W) for treating, comprising a temperature regulating means (133) for regulating the temperature of the treatment liquid, and a temperature regulating mechanism (115) for regulating the temperature of an under plate (77) disposed close to the rear surface of the substrate (W).
Inventors:
ORII TAKEHIKO (JP)
AMAI MASARU (JP)
AMAI MASARU (JP)
Application Number:
PCT/JP2002/008685
Publication Date:
March 13, 2003
Filing Date:
August 28, 2002
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
ORII TAKEHIKO (JP)
AMAI MASARU (JP)
ORII TAKEHIKO (JP)
AMAI MASARU (JP)
International Classes:
H01L21/00; (IPC1-7): H01L21/316; H01L21/304; H01L21/306
Foreign References:
| US6197150B1 | 2001-03-06 | |||
| JPH0774140A | 1995-03-17 | |||
| JP2001085383A | 2001-03-30 | |||
| JPH06163393A | 1994-06-10 | |||
| US6096233A | 2000-08-01 | |||
| JPH11307485A | 1999-11-05 |
Attorney, Agent or Firm:
Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo, JP)
Download PDF:
Previous Patent: IMPROVED MATERIAL FOR USE WITH FERROELECTRICS
Next Patent: PROCESS FOR MAKING A MIM CAPACITOR
Next Patent: PROCESS FOR MAKING A MIM CAPACITOR