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Patent Searching and Data


Title:
SUBSTRATE TREATMENT DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE TREATMENT METHOD AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2022/071105
Kind Code:
A1
Abstract:
Provided is technology comprising: a processing container for processing a substrate; an outer container that covers the outer periphery of the processing container; a gas flow path formed between the outer container and the outer periphery of the processing container; an exhaust path in communication with the gas flow path; an adjustment valve configured to be able to adjust the conductance of the exhaust path; a first exhaust device that is provided on the exhaust path, downstream of the adjustment valve; a pressure sensor that measures the pressure within the outer container; and a control unit configured to be able to control the first exhaust device to adjust the exhaust air volume of the first exhaust device based on the pressure measured by the pressure sensor.

Inventors:
INADA TETSUAKI (JP)
KONISHI JUNYA (JP)
MUROBAYASHI MASAKI (JP)
YASUI TAKESHI (JP)
SATO TAKEO (JP)
Application Number:
PCT/JP2021/035034
Publication Date:
April 07, 2022
Filing Date:
September 24, 2021
Export Citation:
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Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H05H1/46; C23C16/52; H01L21/31
Foreign References:
JP2018117141A2018-07-26
JP2010045195A2010-02-25
JP2010283331A2010-12-16
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