Title:
SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT DEVICE, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2021/200282
Kind Code:
A1
Abstract:
This substrate processing method includes forming a resist film on the surface of a substrate, supplying a treatment liquid including a water-soluble polymer to the surface of the resist film on the substrate to form an interface control film, heating the substrate on which the interface control film has been formed, and exposing the resist film formed on the substrate after heating.
Inventors:
KAWAKAMI SHINICHIRO (JP)
Application Number:
PCT/JP2021/011456
Publication Date:
October 07, 2021
Filing Date:
March 19, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B05C11/08; G03F7/20; G03F7/38; H01L21/027
Domestic Patent References:
| WO2007119384A1 | 2007-10-25 |
Foreign References:
| JP2002148809A | 2002-05-22 | |||
| JP2018029133A | 2018-02-22 | |||
| JP2016213438A | 2016-12-15 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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