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Patent Searching and Data


Title:
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/039974
Kind Code:
A1
Abstract:
[Problem] To reliably prevent collapse of a pattern during a substrate drying process. [Solution] This substrate treatment method for drying a substrate which has a recessed-and-projected pattern on a surface thereof, by removing a liquid on the substrate, comprises: a step for forming, in a recess in the substrate, a solid-state first material which is a lower layer and a solid-state second material which is an upper layer; a step for removing the second material by causing sublimation, decomposition, and a gas reaction of the second material; and a step for subsequently removing the first material by causing decomposition and a gas reaction of the first material.

Inventors:
HIGUCHI RINTARO (JP)
OGATA TSUNEMOTO (JP)
NAKAMORI MITSUNORI (JP)
Application Number:
PCT/JP2019/031577
Publication Date:
February 27, 2020
Filing Date:
August 09, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; F26B3/02; F26B3/28
Foreign References:
JP2018056176A2018-04-05
JP2012129294A2012-07-05
JP2017037940A2017-02-16
JP2013021208A2013-01-31
JP2014138153A2014-07-28
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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